Wiring board and fabrication method therefor
AssigneeIbiden Co., Ltd.
InventorMichimasa TAKAHASHI
Life of this patent
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Abstract
A wiring board includes an insulating board, a wiring sub board having a wiring layer, and an insulating layer. The insulating layer has a via hole in which a conductor is formed by plating. The insulating board and the wiring sub board are horizontally laid out. The insulating layer is laid out to cover a boundary portion between the insulating board and the wiring sub board and continuously extends from the insulating board to the wiring sub board. A resin which constitutes the insulating layer is filled in the boundary portion. The conductor is electrically connected to the wiring layer.
Claims11
A wiring board comprising:
- a wiring sub board having a conductive pattern;
- an insulating board being laid out alongside of the wiring sub board;
- and
- an insulating layer comprising an insulating material and having a via hole in which a conductor electrically connected to the conductive pattern is formed by plating, the insulating layer continuously extending from the insulating board to the wiring sub board so as to cover a boundary portion between the insulating board and the wiring sub board,
- wherein the boundary portion between the insulating board and the wiring sub board is filled with the insulating material.
A method for fabricating a wiring board, comprising:
- horizontally laying an insulating board comprising an insulating material and a wiring sub board having a wiring layer;
- laying an insulating layer comprising an insulating material to cover a boundary portion between the insulating board and the wiring sub board;
- filling the insulating material of the insulating layer in the boundary portion between the insulating board and the wiring sub board;
- forming a via hole in the insulating layer;
- and
- forming a conductor in the via hole by plating such that the conductor electrically connects to the wiring layer.
Dependencies are inferred from the claim text.