Back to results
US 2010/0132978 A1Published application
Whisker-free coating structure and method of fabricating the same
AssigneeNational Taiwan University of Science and Technology
InventorsYee-Wen YEN, Jinn P. Chu, Chon-Hsin Lin, Chun-Lei Hsu, Chao-Kang Li
Life of this patent
Estimating the term…
Abstract
A whisker-free coating structure and a method for fabricating the same are disclosed. The whisker-free coating structure includes a substrate, a tungsten doped copper layer overlaying the substrate, and a lead-free tin layer overlaying the tungsten doped copper layer.
Claims17
A whisker-free coating structure, comprising:
- a substrate;
- a tungsten doped copper layer overlaying the substrate;
- and
- a lead-free tin layer overlaying the tungsten doped copper layer.
1 more element
A method for fabricating a whisker-free coating structure, comprising:
- providing a substrate;
- co-sputtering a tungsten doped copper layer overlaying the substrate utilizing vacuum magnetron sputter deposition;
- and forming a lead-free tin layer overlaying the tungsten doped copper layer.
Dependencies are inferred from the claim text.