Manufacturing method of printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMyung-Sam Kang, Jung-Hyun Park, Ji-Eun Kim
Life of this patent
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Abstract
Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for interlayer connection can include forming a circuit pattern on one side of a carrier, pressing one side of the carrier into one side of the insulator, removing the carrier, forming a hole penetrating through the insulator by processing one end of the circuit pattern, and forming a conductive material inside the hole to have the conductive material correspond to the via.
Claims6
A method of manufacturing a printed circuit board having a via for interlayer connection, the method comprising:
- forming a circuit pattern on one side of a carrier;
- pressing one side of the carrier into one side of an insulator;
- removing the carrier;
- forming a hole penetrating through the insulator by processing one end of the circuit pattern;
- and
- forming a conductive material inside the hole to have the conductive material correspond to the via.
Dependencies are inferred from the claim text.