Dye-sensitized photoelectric conversion element module and a method of manufacturing the same, and photoelectric conversion element module and a method of manufacturing the same, and electronic apparatus

A method of manufacturing a dye-sensitized photoelectric conversion element module having a plurality of dye-sensitized photoelectric conversion elements on a supporting base material, said method comprising:

• the step of using a filmy glass substrate having a thickness of 0.2 mm or less as said supporting base material, and forming said plurality of dye-sensitized photoelectric conversion elements on said filmy glass substrate, thereby forming said dye-sensitized photoelectric conversion element module;
• and
• the step of bonding a resin system protective film having a size equal to or larger than that of said filmy glass substrate to at least one surface of said dye-sensitized photoelectric conversion element module.

An electronic apparatus using a dye-sensitized photoelectric conversion element module, wherein

• said dye-sensitized photoelectric conversion element module is a dye-sensitized photoelectric conversion element module having a plurality of dye-sensitized photoelectric conversion elements on a supporting base material;
• and
• a filmy glass substrate having a thickness of 0.2 mm or less is used as said supporting base material, and a resin system protective film having a size equal to or larger than that of said filmy glass substrate is bonded to at least one surface of said dye-sensitized photoelectric conversion element module.

A photoelectric conversion element module having a plurality of photoelectric conversion elements on a supporting base material, wherein

• a filmy glass substrate having a thickness of 0.2 mm or less is used as said supporting base material, and a resin system protective film having a size equal to or larger than that of said filmy glass substrate is bonded to at least one surface of said photoelectric conversion element module.

A method of manufacturing a photoelectric conversion element module having a plurality of photoelectric conversion elements on a supporting base material, said method comprising:

• the step of using a filmy glass substrate having a thickness of 0.2 mm or less as said supporting base material, and forming said plurality of photoelectric conversion elements on said filmy glass substrate, thereby forming said photoelectric conversion element module;
• and
• the step of bonding a resin system protective film having a size equal to or larger than that of said filmy glass substrate to at least one surface of said photoelectric conversion element module.

An electronic apparatus using a photoelectric conversion element module, wherein

• said photoelectric conversion element module is a photoelectric conversion element module having a plurality of photoelectric conversion elements on a supporting base material;
• and
• a filmy glass substrate having a thickness of 0.2 mm or less is used as said supporting base material, and a resin system protective film having a size equal to or larger than that of said filmy glass substrate is bonded to at least one surface of said photoelectric conversion element module.