Bonds and method for forming bonds for a two-phase cooling apparatus

A two-phase cooling apparatus, comprising:

• an evaporator comprising:
• a silicon layer having porous regions and non-porous regions, the porous regions having a plurality of through-holes extending through the silicon layer;
• a cap structure formed such that when disposed over the silicon layer, at least a portion of the plurality of through-holes are unobstructed to liquid or vapor flow;
• a bonding layer formed between the silicon layer and the cap structure, the bonding layer in contact with at least a portion of the non-porous regions of the first layer;
• the bonding layer comprising:
• an adhesion layer disposed on at least a portion of the non-porous regions of the silicon layer;
• a barrier layer disposed on the adhesion layer;
• and
• a bond comprised substantially of gold and tin disposed on the barrier layer;
• wherein the bonding layer is compatible with liquid and forms a hermetic seal between the silicon layer and the cap structure.

A method of forming an evaporator of a two-phase cooling apparatus, comprising:

• forming porous regions in a semiconductor material layer, the porous regions having a plurality of through-holes in the semiconductor material layer, the semiconductor material layer having non-porous regions exclusive of the porous regions;
• forming a cap structure such that when disposed over the semiconductor material layer, at least a portion of the plurality of through-holes of the semiconductor material layer are unobstructed;
• bonding the silicon layer and the cap structure using a bonding layer;
• wherein, the bonding layer is formed on the semiconductor material layer at a portion of the non-porous regions;
• and
• wherein the bonding layer is compatible with liquid and forms a hermetic seal between the semiconductor material layer and the cap structure.