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US 2010/0132191 A1Published application
Method for Forming a Circuit Board Via Structure for High Speed Signaling
AssigneeMicron Technology, Inc.
InventorsShiyou Zhao, Houfei Chen, Hao Wang
Life of this patent
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Abstract
One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.
Claims8
A method for forming a via, comprising:
- forming a first conductive layer on a first side of a circuit board, and forming a second conductive layer on a second side of the circuit board;
- forming a first hole in the first side of the circuit board, wherein the first hole does not pass all the way through the printed circuit board;
- forming a first conductive material on a vertical edge of the first hole and in contact with the first conductive layer;
- filling the first hole with a first dielectric;
- forming a second hole in the second side of the circuit board and in the first dielectric, wherein the second hole does not pass all the way through the printed circuit board;
- forming a second conductive material on a vertical edge of the second hole, wherein the second conductive material is in contact with the second conductive layer;
- filling the second hole with a second dielectric;
- and
- forming a via in the second dielectric and all the way through the circuit board.
6 more elements
Dependencies are inferred from the claim text.