Method for taking an electronic component out of a carrier tape
AssigneeFujitsu Limited
InventorsTomokazu Nakashima, Masako Okazaki, Masayuki Itoh
Life of this patent
Estimating the term…
Abstract
A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface reduces a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall.
Claims14
A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface, said method comprising the step of:
- reducing a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall.
A manufacturing method of an electronic unit, said manufacturing method comprising the steps of:
- moving a printed board to a mount position;
- reducing a binding force applied by a concave of a carrier tape configured to house an electronic component in the concave that is defined by a sidewall and a bottom surface, by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion adjacent to the sidewall;
- and
- taking the electronic component out of the carrier tape and soldering the electronic component onto the printed board.
A mount unit configured to take an electronic component out of a carrier tape that houses the electronic component in a concave defined by a sidewall and a bottom surface, and to mount the electronic component onto a printed board, said mount unit comprising:
- a binding-force reducer configured to reduce a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall;
- and
- an absorption nozzle configured to absorb a top surface of the electronic component opposite to a bottom surface of the electronic component which is opposite to the bottom surface of the concave.
A assembly line apparatus comprising:
- a supply mechanism configured to supply a carrier tape that is configured to house an electronic component in a concave defined by a sidewall and a bottom surface;
- and
- a mount unit configured to take the electronic component out of the carrier tape and to mount the electronic component onto a printed board, said mount unit including a binding-force reducer configured to reduce a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall.
Dependencies are inferred from the claim text.