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US 2010/0105303 A1Published application
Polishing Pad
AssigneeBestac Advanced Material Co., Ltd.
InventorsAllen Chiu, Shao-Yu Chen, Yu-Lung Jeng
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AssigneeBestac Advanced Material Co., Ltd.
InventorsAllen Chiu, Shao-Yu Chen, Yu-Lung Jeng
Estimating the term…
The present invention provides a polishing pad, and more particularly, a polishing pad with two kinds of groove patterns. The polishing pad includes a polishing surface, on which is formed with at least a first groove and at least a second groove, wherein the characteristic of the polishing pad is in that: the first groove is connected to the second groove, and the width of first groove is larger than that of the second groove and the depth of first groove is larger than that of the second groove. Therefore when the polishing step is performed using the polishing pad, smaller scraps produced after polishing or smaller polishing particles in the slurry or more turbid slurry can flow out of the polishing pad via the second groove, and larger scraps or particles can flow out of the polishing pad via the first groove. Thus the polishing particles or deposits will not easily remain on the polishing pad or further cause scratching and damaging of the surface of polished work piece.
A polishing pad, said polishing pad including a polishing surface, at least a first groove and at least a second groove being formed on said polishing surface, wherein characteristic of said polishing pad being in that:
A polishing pad, said polishing pad including a polishing surface, at least a first groove and at least a second groove in grid pattern being formed on said polishing surface, wherein characteristic of said polishing pad being in that:
Dependencies are inferred from the claim text.