Adhesive for electronic components

Abstract

The present invention has its object to provide an adhesive for bonding electronic components with a constant distance between them, which makes it possible to maintain a distance between bonded electronic components at high accuracy and to provide a highly reliable electronic apparatus, and which can be stably and continuously applied with a jet dispenser. The present invention is an adhesive for bonding electronic components, including spacer particles, an epoxy compound (A), and a curing agent. The spacer particles have a CV value of 10% or less. The epoxy compound (A) has a molecular structure including 10 or less monomer units with an aromatic ring in each repeating unit, is in a state of crystalline solid at 25° C., and has a viscosity of 1 Pa·s or less measured by an E-type viscometer at a temperature of 50 to 80° C.

Dependencies are inferred from the claim text.