Manufacturing method and manufacturing apparatus for semiconductor device
OwnerHironobu Hirata, Masayoshi Yajima +1inventors
InventorsHironobu Hirata, Masayoshi Yajima, Yoshikazu Moriyama
Life of this patent
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Abstract
A manufacturing method for a semiconductor device, including: loading a wafer into a reaction chamber; placing the wafer on a push-up shaft moved up; preheating the wafer under controlling an in-plane temperature distribution of the wafer to be a recess state under a state of placing the wafer on the push-up shaft moved up; lowering the push-up shaft with the wafer kept in the recess state to hold the wafer on a wafer holding member; heating the wafer to a predetermined temperature; rotating the wafer; and supplying a process gas onto the wafer.
Claims20
A manufacturing method for a semiconductor device, comprising:
- loading a wafer into a reaction chamber;
- placing the wafer on a push-up shaft moved up;
- preheating the wafer under controlling an in-plane temperature distribution of the wafer to be a recess state under a state of placing the wafer on the push-up shaft moved up;
- lowering the push-up shaft with the wafer kept in the recess state to hold the wafer on a wafer holding member;
- heating the wafer to a predetermined temperature;
- rotating the wafer;
- and
- supplying a process gas onto the wafer.
A manufacturing apparatus for a semiconductor device, comprising:
- a reaction chamber configured to load a wafer;
- a gas supply mechanism configured to supply process gas to the reaction chamber;
- a gas discharge mechanism configured to discharge gas from the reaction chamber;
- an up/down drive mechanism configured to raise and lower the wafer, the mechanism having a push-up shaft configured to hold the wafer in recess state under a state of placing the wafer on the push-up shaft moved up;
- a wafer holding member configured to place the wafer on the wafer holding member;
- a heater configured to heat the wafer from below the wafer holding member;
- a temperature control mechanism configured to control a temperature of the heater to be higher temperature of a central portion of the wafer than a temperature of an outer-peripheral portion of the wafer;
- and
- a rotating mechanism configured to rotate the wafer.
Dependencies are inferred from the claim text.