Apparatus and method for manufacturing semiconductor element and semiconductor element manufactured by the method

An apparatus for manufacturing a semiconductor element, comprising:

• a processing chamber arranged to accommodate at least a portion of a flexible substrate which has a plurality of effective regions arranged therein along a length direction, and which is step-transferred by one effective region each time;
• a first electrode and a second electrode which are provided in the processing chamber so as to face each other;
• and
• a mask portion provided between the first electrode and the second electrode, and having an opening so as to expose the effective region when each effective region of the flexible substrate is step-transferred between the first electrode and the second electrode;
• wherein
• plasma processing using plasma generated between the first electrode and the second electrode is performed on each effective region of the flexible substrate through the opening of the mask portion, thereby manufacturing a semiconductor element;
• and
• the processing chamber includes:
• a plasma processing portion arranged to perform the plasma processing on an effective region of the flexible substrate which is exposed from the opening of the mask portion;
• a first standby portion which is provided on a carry-in side of the plasma processing portion so as to overlap the mask portion, and in which an effective region of the flexible substrate prior to the plasma processing is positioned;
• and
• a second standby portion which is provided on a carry-out side of the plasma processing portion so as to overlap the mask portion, and in which an effective region of the flexible substrate after the plasma process is positioned.

A method for manufacturing a semiconductor element, comprising:

• a transfer step of step-transferring a flexible substrate, which has a plurality of effective regions arranged along a length direction, by one effective region each time at least in a processing chamber;
• and
• a plasma processing step of performing plasma processing in the processing chamber on each effective region of the flexible substrate step-transferred in the transfer step;
• wherein
• in the plasma processing step, at least adjacent three effective regions of the flexible substrate are accommodated in the processing chamber, and an inner one of the accommodated at least three effective regions is plasma-processed.