Method Of Selectively Plating Without Plating Lines

A method of selectively plating without plating lines, comprising the steps of:

• providing a loading plate having a metalized temporary conductive layer;
• forming a patterning photoresist layer on the temporary conductive layer;
• supplying a plating current with the loading plate and the temporary conductive layer, and according to the patterning photoresist layer, selectively and sequentially plating to form a separating metal layer, a plating protection layer, and a connection pad layer;
• removing the patterning photoresist layer;
• and
• laminating a dielectric plastic film onto the temporary conductive layer, as well as the separating metal layer, the plating protection layer, and the connection pad layer formed thereon,
• wherein when there is no need for supplying the plating current with the loading plate and the temporary conductive layer, the loading plate, the temporary conductive layer and the separating metal layer are removed for exposing the dielectric plastic film and the plating protection layer.