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US 2010/0075479 A1Published application
Semiconductor Device and Method of Forming the Same
AssigneeSamsung Electronics Co., Ltd.
InventorsDongchan Kim, Sungkweon Baek
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Abstract
A method of forming a semiconductor device includes forming a trench on a semiconductor substrate to define an active region, forming a radical oxide layer on a sidewall and a bottom surface of the trench, and forming a nitride layer on the radical oxide layer. The conduction band offset of the radical oxide layer is greater than the conduction band offset of a thermal oxide layer having the same thickness as the radical oxide layer.
Claims16
A method of forming a semiconductor device, comprising:
- forming a trench on a semiconductor substrate to define an active region;
- forming a radical oxide layer on a sidewall and a bottom surface of the trench;
- and
- forming a nitride layer on the radical oxide layer,
- wherein a conduction band offset of the radical oxide layer is greater than a conduction band offset of a thermal oxide layer having the same thickness as the radical oxide layer.
2 more elements
16-19. (canceled)
Dependencies are inferred from the claim text.