Thermal barrier layer for integrated circuit manufacture

A method for assembling integrated circuits comprising:

• selectively applying an activatable thermal barrier material on a chip substrate, the activatable thermal barrier material comprising an IR absorber;
• applying a thermal energy to the activatable thermal barrier material and thereby soften underlying portions of the chip substrate;
• positioning one or more IC elements that are attached to a release layer with respect to the chip substrate such that each IC element contacts a corresponding softened portion of the chip substrate;
• applying pressure to embed each IC element into the corresponding softened portion of the chip substrate, and
• removing the release layer.

A system for integrated circuit assembly comprising:

• a chip substrate supporting one or more transferred IC elements;
• an activatable thermal barrier layer formed on the chip substrate, wherein the activatable thermal barrier material is provided between the one or more IC elements and the chip substrate;
• and
• an energy source directed at said activatable thermal barrier layer, wherein said energy source activates said activatable thermal barrier layer and bonds each transferred IC element onto the chip substrate.