Method of making a semiconductor chip assembly with a post/base/cap heat spreader

A method of making a semiconductor chip assembly, comprising:

• providing a post, a base, an adhesive and a conductive layer, wherein
• the post is adjacent to the base, extends above the base in an upward direction, extends into an opening in the adhesive and is aligned with an aperture in the conductive layer,
• the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions,
• the adhesive is mounted on and extends above the base, is sandwiched between the base and the conductive layer and is non-solidified, and
• the conductive layer is mounted on and extends above the adhesive;
• then
• flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer;
• solidifying the adhesive;
• then
• providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer;
• providing a cap on the post that is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;
• then
• mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post;
• electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal;
• and
• thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.

A method of making a semiconductor chip assembly, comprising:

• providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;
• providing an adhesive, wherein an opening extends through the adhesive;
• providing a conductive layer, wherein an aperture extends through the conductive layer;
• mounting the adhesive on the base, including inserting the post into the opening, wherein the adhesive extends above the base and the post extends into the opening;
• mounting the conductive layer on the adhesive, including aligning the post with the aperture, wherein the conductive layer extends above the adhesive and the adhesive is sandwiched between the base and the conductive layer and is non-solidified;
• then
• applying heat to melt the adhesive;
• moving the base and the conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the conductive layer;
• applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the conductive layer;
• then
• providing a conductive trace that includes a pad, a terminal and a routing line, wherein the pad, the terminal and the routing line include selected portions of the conductive layer and an electrically conductive path between the pad and the terminal includes the routing line;
• providing a cap that is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;
• then
• mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post;
• electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal;
• and
• thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.

A method of making a semiconductor chip assembly, comprising:

• providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;
• providing an adhesive, wherein an opening extends through the adhesive;
• providing a first conductive layer, wherein an aperture extends through the first conductive layer;
• mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening;
• mounting the first conductive layer alone on the adhesive, including inserting the post into the aperture, wherein the first conductive layer extends above the adhesive, the post extends through the opening into the aperture, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the first conductive layer and is non-solidified, and a gap is located in the aperture between the post and the first conductive layer;
• then
• applying heat to melt the adhesive;
• moving the base and the first conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the first conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in the gap;
• applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the first conductive layer;
• then
• depositing a second conductive layer on the post, the adhesive and the first conductive layer;
• then
• providing a conductive trace that includes a pad, a terminal and a routing line, wherein the pad, the terminal and the routing line include selected portions of the first conductive layer and an electrically conductive path between the pad and the terminal includes the routing line;
• providing a cap on the post that includes a selected portion of the second conductive layer, including removing selected portions of the second conductive layer, wherein the cap is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;
• then
• mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap, the semiconductor device overlaps the post and includes a thermal contact surface that faces towards the cap, the cap is shaped and sized to accommodate the thermal contact surface and the top of the post is not shaped and sized to accommodate the thermal contact surface;
• electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal;
• and
• thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.

A method of making a semiconductor chip assembly, comprising:

• providing a post, a base, an adhesive and a substrate, wherein
• the substrate includes a conductive layer and a dielectric layer,
• the post is adjacent to the base, extends above the base in an upward direction, extends through an opening in the adhesive and extends into an aperture in the substrate,
• the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions,
• the adhesive is mounted on and extends above the base, is sandwiched between the base and the substrate and is non-solidified,
• the substrate is mounted on and extends above the adhesive, and the conductive layer extends above the dielectric layer, and
• a gap is located in the aperture between the post and the substrate;
• then
• flowing the adhesive into and upward in the gap;
• solidifying the adhesive;
• then
• providing a cap on the post that is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;
• then
• mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap, the semiconductor device overlaps the post, a conductive trace includes a pad, a terminal and a selected portion of the conductive layer and the pad is electrically connected to the terminal;
• electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal;
• and
• thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.

A method of making a semiconductor chip assembly, comprising:

• providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;
• providing an adhesive, wherein an opening extends through the adhesive;
• providing a substrate that includes a conductive layer and a dielectric layer, wherein an aperture extends through the substrate;
• mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening;
• mounting the substrate on the adhesive, including inserting the post into the aperture, wherein the substrate extends above the adhesive, the conductive layer extends above the dielectric layer, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the substrate and is non-solidified, and a gap is located in the aperture between the post and the substrate;
• then
• applying heat to melt the adhesive;
• moving the base and the substrate towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in the gap and the post and the molten adhesive extend above the dielectric layer;
• applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the substrate;
• then
• providing a pad, a terminal and a cap, wherein the pad includes a selected portion of the conductive layer and the cap is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;
• then
• mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap, the semiconductor device overlaps the post and the pad is electrically connected to the terminal;
• electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal;
• and
• thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.

A method of making a semiconductor chip assembly, comprising:

• providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;
• providing an adhesive, wherein an opening extends through the adhesive;
• providing a substrate that includes a first conductive layer and a dielectric layer, wherein an aperture extends through the substrate;
• mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening;
• mounting the substrate on the adhesive, including inserting the post into the aperture, wherein the substrate extends above the adhesive, the first conductive layer extends above the dielectric layer, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the substrate and is non-solidified, and a gap is located in the aperture between the post and the substrate;
• then
• applying heat to melt the adhesive;
• moving the base and the substrate towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in the gap and the post and the molten adhesive extend above the dielectric layer;
• applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the substrate;
• then
• depositing a second conductive layer on the post, the adhesive and the first conductive layer;
• then
• providing a pad and a terminal that include selected portions of the conductive layers, including removing selected portions of the conductive layers;
• providing a cap on the post that includes a selected portion of the second conductive layer, including removing selected portions of the second conductive layer, wherein the cap is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;
• then
• mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap, the semiconductor device overlaps the post and includes a thermal contact surface that faces towards the cap, the pad is electrically connected to the terminal, the cap is shaped and sized to accommodate the thermal contact surface and the top of the post is not shaped and sized to accommodate the thermal contact surface;
• electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal;
• and
• thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.