Template inspection method and manufacturing method for semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsIkuo YONEDA, Tetsuro Nakasugi, Masamitsu Itoh, Ryoichi Inanami
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Abstract
A template inspection method for performing defect inspection of a template, by bringing a pattern formation surface of a template used to form a pattern close to a first fluid coated on a flat substrate, filling the first fluid into a pattern of the template, and by performing optical observation of the template in a state that the first fluid is sandwiched between the template and the substrate, wherein a difference between an optical constant of the first fluid and an optical constant of the template is larger than a difference between an optical constant of air and the optical constant of the template.
Claims19
A template inspection method for performing defect inspection of a template, by bringing a pattern formation surface of a template used to form a pattern close to a first fluid coated on a flat substrate, filling the first fluid into a pattern of the template, and by performing optical observation of the template in a state that the first fluid is sandwiched between the template and the substrate, wherein
- a difference between an optical constant of the first fluid and an optical constant of the template is larger than a difference between an optical constant of air and the optical constant of the template.
A template inspection method for performing defect inspection of a template, by bringing a pattern formation surface of a template used to form a pattern close to a first fluid coated on a flat substrate, filling the first fluid into a pattern of the template, and by performing optical observation of the template in a state that the first fluid is sandwiched between the template and the substrate, wherein
- an optical constant of the first fluid is the same as an optical constant of the template.
A template inspection method for performing defect inspection of a template, by bringing a pattern formation surface of the template used to form a pattern close to a conductive light-curing material coated on a flat substrate, filling the conductive light-curing material into a pattern of the template, irradiating light to the conductive light-curing material in a state that the conductive light-curing material is sandwiched between the template and the substrate, thereby hardening the conductive light-curing material and transferring the pattern of the template to the conductive light-curing material, and by performing electron beam observation of a transfer pattern of the conductive light-curing material.
A manufacturing method for a semiconductor device, by bringing a pattern formation surface of a template used to form a pattern close to a first fluid coated on a flat first substrate, filling the first fluid into a pattern of the template, performing defect inspection of the template by performing optical observation of the template in a state that the first fluid is sandwiched between the template and the first substrate and a difference of an optical constant between the first fluid and the template is larger than a difference of the optical constant between air and the template, bringing a template which is confirmed to have no defect into contact with a curable material layer coated on a second substrate, and by forming a pattern on the second substrate by curing the curable material layer.
Dependencies are inferred from the claim text.