Methods of treating a surface to promote metal plating and devices formed
OwnerWerner G. Kuhr, Steven Z. Shi +3inventors
InventorsWerner G. Kuhr, Steven Z. Shi, Jen-Chieh Wei, Zhiming Liu, Lingyun Wei
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Abstract
Embodiments of the present invention provide methods of treating a surface of a substrate. In one embodiment a kit for carrying out the binding of metals to a substrate is provided, comprising: a container comprising a heat-resistant organic molecule derivatized with an attachment group Y and a binding group X, the binding group X promotes binding of metals; and instructional materials teaching coupling the organic molecule to the substrate by heating the molecule and/or the surface to a temperature of at least 25° C.
Claims11
A kit for carrying out the binding of metals to a substrate, comprising:
- a container comprising a heat-resistant organic molecule derivatized with an attachment group Y and a binding group X, the binding group X promotes binding of metals;
- and
- instructional materials teaching coupling the organic molecule to the substrate by heating the molecule and/or the surface to a temperature of at least 25° C.
Dependencies are inferred from the claim text.