Master disk for transfer and manufacturing method of the same
AssigneeFUJIFILM Corporation
InventorTakeo KIDO
Life of this patent
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Abstract
A manufacturing method of a master disk for transfer having an uneven pattern corresponding to information to be transferred comprises an initial layer forming step of forming an initial layer containing a nickel film on a surface of a reverse type master disk; an electroforming step of forming a metal layer so as to layer the metal layer on the initial layer by an electroforming method; and a peeling off step of peeling off a duplicated disk having at least two layers that are the initial layer and the metal layer to be integrated from the reverse type master disk after the electroforming step, and obtaining the master disk for transfer that is the duplicated disk with the initial layer being formed by being stacked on an uneven surface of the metal layer.
Claims5
A manufacturing method of a master disk for transfer having an uneven pattern corresponding to information to be transferred, comprising:
- an initial layer forming step of forming an initial layer containing a nickel (Ni) film with a density of 8.3 g/cm3 to 8.9 g/cm3 on a surface of a reverse type master disk having a reverse uneven pattern;
- an electroforming step of forming a metal layer so as to layer the metal layer on the initial layer of the reverse type master disk by an electroforming method after forming the initial layer;
- and
- a peeling off step of peeling off a duplicated disk having at least two layers that are the initial layer and the metal layer to be integrated from the reverse type master disk after the electroforming step so as to obtain the master disk for transfer that is the duplicated disk with the initial layer being formed by being stacked on an uneven surface of the metal layer.
A master disk for transfer comprising:
- a metal disk which is formed by electroforming;
- an uneven pattern which is formed on the surface of the metal disk and corresponds to information to be transferred;
- an initial layer which is stacked and formed on the uneven pattern, containing a nickel (Ni) film with a density of 8.3 g/cm3 to 8.9 g/cm3 and used to be a conductive layer at a time of performing the electroforming.
Dependencies are inferred from the claim text.