Microchip, Molding Die and Electroforming Master
OwnerMakoto Takagiinventor
Life of this patent
Estimating the term…
Abstract
The present invention relates to a microchip, a die for forming the microchip, and an electroforming master for the die. A microchip is formed of a resin material and includes: a resin material; and a surface on which a channel groove with a width and depth both in a range of 1 to 1000 μm is formed. A bottom surface of the channel groove includes a projecting-and-depressed section with a height of 5% or lower of the depth of the channel groove.
Claims7
A microchip comprising:
- a surface on which a channel groove with a width and depth both in a range of 1 to 1000 μm is formed,
- wherein a bottom surface of the channel groove comprises a projecting-and-depressed section with a height of 5% or lower of the depth of the channel groove, and
- the microchip is formed of a resin material.
A die for forming a microchip, the microchip being formed of a resin material and comprising a surface on which a channel groove with a width and depth both in a range of 1 to 1000 μm is formed,
- the die comprising:
- a projecting potion corresponding to forming the channel groove of the microchip,
- wherein a top surface of the projecting portion comprises a die projecting-and-depressed section with a height of 5% or lower of a height of the projecting portion.
Dependencies are inferred from the claim text.