Deformable thermal pads for optical fibers
AssigneePyroPhotonics Lasers Inc.
InventorsTullio Panarello, Marc Blanchet, Stephane Caplette, Ghislain Lamothe
Life of this patent
Estimating the term…
Abstract
A system for fiber optic packaging includes a first substrate and a first deformable pad coupled to the first substrate. The first deformable pad is characterized by a thermal conductivity greater than 1 W/mK. The system also includes a fiber coil having at least a portion embedded in the first deformable pad to provide physical contact between the at least a portion of the fiber coil and the first deformable pad. The system further includes a second substrate coupled to the fiber coil and at least a portion of the first deformable pad.
Claims25
A system for fiber optic packaging, the system comprising:
- a first substrate;
- a first deformable pad coupled to the first substrate, wherein the first deformable pad is characterized by a thermal conductivity greater than 1 W/mK;
- a fiber coil having at least a portion embedded in the first deformable pad to provide physical contact between the at least a portion of the fiber coil and the first deformable pad;
- and
- a second substrate coupled to the fiber coil and at least a portion of the first deformable pad.
A fiber coil package for an optical fiber, the fiber coil package comprising:
- a support structure;
- a first deformable pad, wherein the first deformable pad is characterized by a thermal conductivity greater than 1 W/mK;
- a length of the optical fiber, wherein at least a first portion of the length of the optical fiber is embedded in the first deformable pad to provide physical contact between the at least the first portion of the fiber coil and the first deformable pad;
- and
- a jacket surrounding the optical fiber and at least a portion of the first deformable pad.
A method of packaging an optical fiber coil, the method comprising:
- providing a support structure;
- coupling a first deformable pad to surround at least a portion of the support structure, wherein the first deformable thermal pad is characterized by a thermal conductivity greater than 1 W/mK;
- embedding a length of the optical fiber coil in the first deformable pad, wherein at least a first portion of the length of the optical fiber coil is in physical contact with the first deformable pad;
- and
- surrounding at least a portion of the first deformable pad with a jacket.
Dependencies are inferred from the claim text.