Piezoelectric microspeaker and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSeok-whan CHUNG, Dong-kyun KIM, Byung-gil JEONG
Life of this patent
Estimating the term…
Abstract
Provided are a piezoelectric microspeaker and a method of fabricating the same. In the piezoelectric microspeaker, a diaphragm includes a first region and a second region. The first region may be formed of a material capable of maximizing an exciting force, and the second region may be formed of a material having less initial stress and a lower Young's modulus than the first region.
Claims14
A piezoelectric microspeaker comprising:
- a piezoelectric plate which deforms according to a voltage applied thereto;
- and
- a diaphragm which vibrates due to deformation of the piezoelectric plate,
- wherein the diaphragm comprises a first region and a second region, wherein the first region is formed of a first material having a Young's modulus substantially the same as a Young's modulus of a material of the piezoelectric plate, and the second region is formed of a second material having a Young's modulus lower than the Young's modulus of the first material.
A method of fabricating a piezoelectric microspeaker, the method comprising:
- forming a diaphragm by depositing an insulating layer on a substrate;
- forming a lower electrode by depositing a first metal layer on the diaphragm and etching the first metal layer;
- forming a piezoelectric plate by depositing a piezoelectric layer on the lower electrode and etching the piezoelectric layer;
- forming an upper electrode by depositing a second metal layer on the piezoelectric plate and etching the second metal layer;
- etching and removing a part of the diaphragm;
- and
- forming a polymer layer on a region the substrate including a region of the substrate from which the part of the diaphragm is removed.
A method of fabricating a piezoelectric microspeaker, comprising:
- forming an etch stop layer on a first side of a substrate;
- forming a diaphragm on a second side of the substrate by depositing an insulating layer on the substrate;
- forming a lower electrode by depositing a first metal layer on the diaphragm and etching the first metal layer;
- forming a piezoelectric plate by depositing a piezoelectric layer on the lower electrode and etching the piezoelectric layer;
- forming an upper electrode by depositing a second metal layer on the piezoelectric plate and etching the second metal layer;
- forming a polymer layer on the upper electrode;
- releasing the diaphragm by etching a part of the substrate from the first side of the substrate;
- removing a part of the diaphragm exposed to the first side of the substrate;
- and
- removing the etch stop layer.
A method of fabricating a piezoelectric microspeaker, comprising:
- forming a diaphragm on a first side of a substrate by depositing an insulating layer on the substrate;
- forming a lower electrode by depositing a first metal layer on the diaphragm and etching the first metal layer;
- forming a piezoelectric plate by depositing a piezoelectric layer on the lower electrode and etching the piezoelectric layer;
- forming an upper electrode by depositing a second metal layer on the piezoelectric plate and etching the second metal layer;
- releasing the diaphragm by etching a part of the substrate from a second side of the substrate;
- depositing a polymer layer on the released diaphragm in the etched part of the substrate;
- and
- removing a part of the diaphragm.
Dependencies are inferred from the claim text.