Structure of mems electroacoustic transducer and fabricating method thereof
AssigneeUnited Microelectronics Corp.
InventorsBang-Chiang Lan, Ming-I Wang, Li-Hsun Ho, Hui-Min Wu, Min Chen, Chien-Hsin Huang
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Abstract
A structure of a micro-electro-mechanical systems (MEMS) electroacoustic transducer includes a substrate, a diaphragm, a silicon material layer, and a conductive pattern. The substrate includes an MEMS device region. The diaphragm has openings, and is disposed in the MEMS device region. A first cavity is formed between the diaphragm and the substrate. The silicon material layer is disposed on the diaphragm and seals the diaphragm. The conductive pattern is disposed beneath the diaphragm in the MEMS device region.
Claims20
A structure of micro-electro-mechanical systems (MEMS) electroacoustic transducer, comprising:
- a substrate, comprising an MEMS device region;
- a diaphragm, having openings and disposed in the MEMS device region, wherein a first cavity is formed between the diaphragm and the substrate;
- a silicon material layer, disposed on the diaphragm and sealing the diaphragm;
- and
- a conductive pattern, disposed beneath the diaphragm in the MEMS device region.
A fabricating method of a structure of micro-electro-mechanical systems (MEMS) electroacoustic transducer, comprising:
- providing a substrate that comprises a circuit region and an MEMS device region;
- forming a first metal interconnect structure on a front side of the substrate in the circuit region, and at the same time forming a first dielectric layer structure located at the front side of the substrate, a conductive pattern located in first dielectric layer structure, and a diaphragm located on the first dielectric layer structure and having openings in the MEMS device region;
- forming a sealing layer on the diaphragm for sealing the diaphragm;
- forming a second metal interconnect structure on the first metal interconnect structure, and at the same time forming a second dielectric layer structure on the sealing layer in the MEMS device region;
- forming a first hard mask layer on the second metal interconnect structure;
- forming a second hard mask layer on a back side of the substrate in the circuit region;
- forming a vent hole in the substrate in the MEMS device region;
- and
- removing the first dielectric layer structure and the second dielectric layer structure by the use of the first hard mask layer and the second hard mask layer as a mask.
A fabricating method of a structure of micro-electro-mechanical systems (MEMS) electroacoustic transducer, comprising:
- providing a substrate that comprises a circuit region, an MEMS device region, and a vent hole region;
- forming a first metal interconnect structure on the substrate in the circuit region, and at the same time, forming a first dielectric layer structure located on the substrate, a conductive pattern located in the first dielectric layer structure, and a diaphragm located on the first dielectric layer structure and having openings in the MEMS device region, and forming the first dielectric layer structure located on the substrate and a vent hole layer located on the first dielectric layer structure and having a vent hole in the vent hole region;
- forming a sealing layer on the diaphragm for sealing the diaphragm;
- forming a second metal interconnect structure on the first metal interconnect structure, and at the same time forming a second dielectric layer structure on the sealing layer in the MEMS device region and on the vent hole layer in the vent hole region;
- forming a hard mask layer on the second metal interconnect structure;
- and
- removing the first dielectric layer structure and the second dielectric layer structure by the use of the hard mask layer as a mask.
Dependencies are inferred from the claim text.