Film forming method, thermal conduction member, power module, vehicle inverter, and vehicle

Abstract

There is provided a film forming method capable of enhancing adhesion efficiency of a metal powder by use of a low-pressure compressed gas even in the case of spraying the metal powder remaining in a solid-phase state to a substrate, to form a film, the method being a film forming method of spraying a metal powder p in a solid-phase state to a surface 11a of a substrate 11 along with a compressed gas, to form a film 12 of the metal powder p on the surface 11a of the substrate 11, wherein a powder, which at least contains a powder for film formation having an apparent density of 1.4 to 2.0 g/cm3 and an average grain size of not larger than 25 μm, is used as the metal powder p.

Dependencies are inferred from the claim text.