Overmolded semiconductor package with an integrated antenna
AssigneeSkyworks Solutions, Inc.
InventorsThomas Noll, Gye-An Lee
Life of this patent
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Abstract
According to an exemplary embodiment, an overmolded semiconductor package includes at least one semiconductor die situated over a package substrate. The overmolded semiconductor package further includes a mold compound overlying the at least one semiconductor die and the package substrate. The overmolded semiconductor package further includes a conductive layer situated on an outer surface of the mold compound and having an opening. The overmolded semiconductor package further includes an antenna feed line situated in the mold compound and having a portion exposed in the opening in the conductive layer, thereby providing an antenna input on the outer surface of the mold compound.
Claims20
An overmolded semiconductor package comprising:
- at least one semiconductor die situated over a package substrate;
- a mold compound overlying said at least one semiconductor die and said package substrate;
- a conductive layer situated on an outer surface of said mold compound;
- an antenna feed line situated in said mold compound and having a portion exposed in an opening in said conductive layer so as to provide an antenna input on said outer surface of said mold compound.
An overmolded semiconductor package comprising:
- at least one semiconductor die situated over a package substrate;
- a support structure situated over said package substrate and said at least one semiconductor die;
- an antenna situated on said support structure;
- a mold compound overlying said at least one semiconductor die, said package substrate, and said support structure;
- an antenna feed line situated in said mold compound.
Dependencies are inferred from the claim text.