Laser ablation to create pocket for die placement
OwnerRoger S. Kerr, Timothy J. Tredwell +1inventors
InventorsRoger S. Kerr, Timothy J. Tredwell, Seung-Ho Baek
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Abstract
Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and scalably embedding or seating IC elements onto/into a receiving substrate, such as a chip substrate. Specifically, the assembly of IC chips can include forming a pocket in the receiving substrate to accommodate the IC elements therein. Such pockets can be formed in the receiving substrate using laser ablation.
Claims20
A method for assembling integrated circuits comprising:
- providing a chip substrate;
- applying a laser source to a surface of the chip substrate for selectively ablating one or more portions of the chip substrate;
- positioning one or more IC elements that are attached to a release layer with respect to the chip substrate such that each IC element contacts a corresponding ablated portion of the chip substrate;
- and
- embedding each IC element into the corresponding ablated portion of the chip substrate.
A method for assembling integrated circuits comprising:
- selectively ablating a chip substrate to form one or more pockets in the chip substrate;
- positioning one or more IC elements that are attached to a release layer with respect to the chip substrate such that each IC element contacts a corresponding pocket of the chip substrate;
- and
- embedding each IC element into the corresponding pocket of the chip substrate.
An integrated circuit assembly comprising:
- a chip substrate selectively ablated at one or more portions thereof by a laser ablation;
- one or more released IC elements embedded in a bump side up orientation into the corresponding ablated portion of the chip substrate;
- and
- supporting electronics printed on the chip substrate, wherein the supporting electronics electrically contact each exposed IC element.
Dependencies are inferred from the claim text.