Multi-structure thermally trimmable resistors
AssigneeMicrobridge Technologies Inc.
InventorsOleg Grudin, Salman Saed, Tommy Tsang, Bowei Zhang, Leslie M. Landsberger, L. Richard Williston
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AssigneeMicrobridge Technologies Inc.
InventorsOleg Grudin, Salman Saed, Tommy Tsang, Bowei Zhang, Leslie M. Landsberger, L. Richard Williston
Estimating the term…
A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor.
-21. (canceled)
A substrate comprising a plurality of thermally isolated microstructures each housing at least part of a thermally-trimmable resistor, said thermally-trimmable resistor having at least a functional resistor, said thermally isolated microstructures provided in pairs of facing microstructures, said pairs grouped together into sets, each of said sets having at least one pair of facing microstructures, and each set being arranged for heat-sharing, each microstructure in a given set exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor during a trimming procedure.
A substrate comprising a plurality of thermally isolated microstructures each housing at least part of a thermally-trimmable resistor, said thermally-trimmable resistor having at least a functional resistor, said thermally isolated microstructures being arranged in sets of pairs of facing microstructures for heat-sharing, said microstructures in a given set arranged to minimize a temperature difference between microstructures for a same resistor during a trimming procedure, said temperature difference caused by a spatial relationship and a number of neighboring microstructures for a same resistor from whom heat is shared, a diagonal neighbor providing less heat than a facing or side neighbor, each set having at least three pairs of facing microstructures.
A substrate comprising a plurality of thermally isolated microstructures each housing at least part of a thermally-trimmable resistor, said thermally-trimmable resistor having at least a functional resistor, said thermally isolated microstructures being arranged in sets of pairs of facing microstructures for heat-sharing, said microstructures arranged within a given set to have a smaller number of microstructures exposed to less heat from its neighbors compared to other microstructures in the given set, than microstructures exposed to more heat from its neighbors compared to other microstructures in the given set during a trimming procedure, a level of heat being a result of a spatial relationship and a number of neighboring microstructures for a same resistor from whom heat is shared, a diagonal neighbor providing less heat than a facing or side neighbor.
Dependencies are inferred from the claim text.