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US 2010/0073022 A1Published application
In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit
AssigneeHamilton Sundstrand Corporation
InventorTed R. Schnetker
Life of this patent
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Abstract
A monitoring system includes a monitor chip or chips soldered to a printed wiring board. By mirroring a function IC chip interface with the monitor chip, the consumed and remaining thermal/and or vibration-fatigue life of the function IC chip based on the life-environment actually experienced through monitoring of the monitor chip is readily determined. The monitor chip includes monitoring interconnections and/or circuitry which determines the number and/or location of failed-open solder terminations of the monitor chip.
Claims11
An electronic component comprising:
- a printed circuit board;
- a function IC chip having a function IC chip solder termination pattern between said function IC chip and said printed circuit board;
- and
- a monitor chip having a monitor chip solder termination pattern between said monitor chip and said printed circuit board, said monitor chip solder termination pattern representative of said function IC chip solder termination pattern to determine an accumulated vibration stress fatigue experienced by said function IC chip.
1 more element
Dependencies are inferred from the claim text.