Semiconductor apparatus with thin semiconductor film

A semiconductor apparatus including a circuit board and a semiconductor chip mounted thereon, the semiconductor chip comprising:

• a semiconductor substrate having a substantially planarized surface, having an integrated circuit formed therein, and having at least one terminal electrically connected to the integrated circuit;
• a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed on the substantially planarized surface of the semiconductor substrate, an under surface of the thin semiconductor film facing the semiconductor substrate being closely bonded to the substantially planarized surface of the semiconductor substrate, the thin semiconductor film being less than about 10 μm thick, and forming a step with the semiconductor substrate;
• and
• an individual interconnecting line formed as a thin conductive film extending from an upper surface of the semiconductor device in the thin semiconductor film, along a top surface of the thin semiconductor film to an edge thereof, along a rise of the step, and to the terminal on the semiconductor substrate, respectively, and electrically connecting the semiconductor device to the terminal.