Semiconductor device
AssigneeDenso Corporation
InventorShigekazu Kataoka
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Abstract
A semiconductor device is disclosed which includes a metal base, a semiconductor chip, a lead, and a sealant. The semiconductor chip has an opposite pair of first and second electrode surfaces and a side surface. The semiconductor chip is fixed on the metal base with the first electrode surface solder-connected to the metal base. The lead is solder-connected to the second electrode surface of the semiconductor chip. The sealant seals, at least, the side surface of the semiconductor chip and solders connecting the metal base, the semiconductor chip, and the lead. Further, the lead has a small-cross-section portion which has a smaller cross-sectional area perpendicular to the longitudinal direction of the lead than other portions of the lead adjacent to the small-cross-section portion.
Claims9
A semiconductor device comprising:
- a metal base;
- a semiconductor chip having an opposite pair of first and second electrode surfaces and a side surface, the semiconductor chip being fixed on the metal base with the first electrode surface solder-connected to the metal base;
- a lead that is solder-connected to the second electrode surface of the semiconductor chip;
- and
- a sealant that seals, at least, the side surface of the semiconductor chip and solders connecting the metal base, the semiconductor chip, and the lead,
- wherein
- the lead has a small-cross-section portion which has a smaller cross-sectional area perpendicular to a longitudinal direction of the lead than other portions of the lead adjacent to the small-cross-section portion.
Dependencies are inferred from the claim text.