Tab package connecting host device element
AssigneeSamsung Electronics Co., Ltd.
InventorsYe-chung Chung, Sa-yoon Kang
Life of this patent
Estimating the term…
Abstract
A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.
Claims15
A tape automated bonding (TAB) package comprising:
- a base film;
- a plurality of output leads formed on the base film, at least one of the output leads comprising an inner lead portion and a corresponding outer lead portion;
- a semiconductor die mounted on the base film and connected to the inner lead portion through a solder ball;
- and
- a solder resist film formed on the outer lead portion, wherein the outer lead portion comprises:
- an end portion adjacent to an edge of the base film, the end portion having a first width;
- a terminal portion adjacent to the inner lead portion, the terminal portion having a second width;
- and
- a transition region disposed between the end portion and the terminal portion, the transition region having a third width that varies from the first width to the second width,
- wherein the solder resist film covers at least a part of the terminal portion and exposes at least a part of the transition region,
- wherein the base film is bent at a position on which the transition region is formed.
A TAB package comprising:
- a base film;
- a plurality of output leads formed on the base film, at least one of the output leads comprising an inner lead portion and a corresponding outer lead portion;
- a semiconductor die mounted on the base film and connected to the inner lead portion through a solder ball;
- and
- an encapsulating material formed between the semiconductor die and the inner lead portion, the encapsulating material surrounding the solder ball and a part of the semiconductor die,
- wherein the outer lead portion comprises:
- an end portion adjacent to an edge of the base film, the end portion having a first width;
- a terminal portion adjacent to the inner lead portion, the terminal portion having a second width;
- and
- a transition region disposed between the end portion and the terminal portion, the transition region having a third width that varies from the first width to the second width,
- wherein the base film is bent at a position on which the transition region is formed.
Dependencies are inferred from the claim text.