Integrated circuit package system for stackable devices
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Rui Huang, Heap Hoe Kuan
Life of this patent
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Abstract
An integrated circuit package system provides: forming a stack module including: providing a stack die and encapsulating the stack die with an insulating material having a protruding support and a pad connected to the stack die; mounting the stack module on a package base; connecting the pad to the package base; mounting a top die on the protruding support; connecting the top die to the package base; and encapsulating the top die, the package base, and the stack module with a package encapsulant.
Claims20
An integrated circuit package system comprising:
- forming a stack module including:
- providing a stack die, and
- encapsulating the stack die with an insulating material having a protruding support and a pad connected to the stack die;
- mounting the stack module on a package base;
- connecting the pad to the package base;
- mounting a top die on the protruding support;
- connecting the top die to the package base;
- and
- encapsulating the top die, the package base, and the stack module with a package encapsulant.
An integrated circuit package system comprising:
- forming an internal stacking module including:
- providing a stack die, and
- encapsulating the stack die with an insulating material having a protruding support and a pad connected to the stack die;
- providing a package base having a component surface;
- mounting the internal stacking module on the component surface;
- connecting a stack interconnect between the pad and the component surface;
- mounting a top die on the protruding support;
- connecting a top die interconnect between the top die and the component surface;
- and
- applying a package encapsulant over the top die, over the component surface, and adjacent the internal stacking module, the stack interconnect and the top die interconnect.
An integrated circuit package system comprising:
- a stack module including:
- a stack die, and
- the stack die encapsulated with an insulating material having a protruding support and a pad connected to the stack die;
- the stack module mounted on a package base;
- the pad connected to the package base;
- a top die connected to the package base;
- and
- the top die, the package base, and the stack module encapsulated with a package encapsulant.
Dependencies are inferred from the claim text.