Integrated circuit package system with anti-peel pad

An integrated circuit package system comprising:

• forming a protrusion ring from a manufacturing carrier;
• forming a mask over the manufacturing carrier with an interior of the protrusion ring exposed;
• forming an anti-peel pad over the protrusion ring and over the mask with the anti-peel pad having both a concave ring and the external terminal, and the concave ring, having a peripheral wall, surrounding the external terminal;
• removing the mask with the peripheral wall overhanging the manufacturing carrier;
• connecting an integrated circuit with the external terminal;
• forming an encapsulation over the integrated circuit, the concave ring, and the external terminal with the encapsulation under the peripheral wall and the external terminal exposed from the encapsulation;
• and
• removing the manufacturing carrier with the anti-peel pad and the encapsulation exposed.

An integrated circuit package system comprising:

• an anti-peel pad having both a concave ring and an external terminal with the concave ring, having a peripheral wall, surrounding the external terminal;
• an integrated circuit connected to the anti-peel pad;
• and
• an encapsulation over the integrated circuit, the concave ring, and the external terminal with the encapsulation under the peripheral wall.