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US 2010/0072589 A1Published application
Semiconductor package system with die support pad
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Dioscoro A. Merilo, Lionel Chien Hui Tay
Life of this patent
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Abstract
A semiconductor package system includes: providing a leadframe with a lead; making a die support pad separately from the leadframe; attaching a semiconductor die to the die support pad through a die attach adhesive, the semiconductor die being spaced from the lead; and connecting a bonding pad on the semiconductor die to the lead using a bonding wire.
Claims20
A semiconductor package system comprising:
- providing a leadframe with a lead;
- making a die support pad separately from the leadframe;
- attaching a semiconductor die to the die support pad through a die attach adhesive, the semiconductor die being spaced from the lead;
- and
- connecting a bonding pad on the semiconductor die to the lead using a bonding wire.
2 more elements
A semiconductor package system comprising:
- providing a leadframe with a lead;
- making a die support pad separately from the lead frame;
- attaching a semiconductor die to the die support pad through a die attach adhesive, a space between the semiconductor die and the lead being filled with the die attached adhesive;
- and
- connecting a bonding pad on the semiconductor die to the lead using a bonding wire.
2 more elements
A semiconductor package system comprising:
- a leadframe with a lead;
- a die support pad made separately from the leadframe;
- a semiconductor die attached to the die support pad through a die adhesive;
- and
- a boding wire connecting a bonding pad on the semiconductor die to the lead.
2 more elements
Dependencies are inferred from the claim text.