Ic socket having heat dissipation function
OwnerMasahito Naitoinventor
Life of this patent
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Abstract
It is an object of the present invention to provide an IC socket that has a configuration to promote heat dissipation from an IC device in a simple configuration, and prevent overheating of the IC device under test. Contact pins 6c, similar to the contact pins 6a and 6b, are disposed in regions not corresponding to the signal balls 51 and the thermal balls 52 of the BGA device 5. Further, the contact pins 6c and the second contact pins 6b that are contacted to the thermal balls 52 are thermally connected to each other via a heat spreader.
Claims9
An IC socket comprising a socket main body in which an IC device is disposed, and plural first contactors and plural second contactors that are disposed in a lower projection region of the IC device disposed on the socket main body, the first contactors being electrically connected to the IC device, the second contactors being not electrically connected to the IC device and thermally connected to the IC device,
- wherein the IC socket includes a heat spreader that is made of a material having higher thermal conductivity than thermal conductivity of the socket main body, and that thermally connects each of the second conductors.
Dependencies are inferred from the claim text.