Top exposed clip with window array
AssigneeAlpha and Omega Semiconductor Incorporated
InventorsLei Shi, Zhao Liang, Kai Liu
Life of this patent
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Abstract
A clip for a semiconductor device package may include a metal sheet including an array of windows and one or more conductive fingers. Each of the conductive fingers has a first end and a second end. The first end is electrically connected to the metal sheet at one of the windows. Each of the conductive fingers is adapted to provide electrical connection to a top semiconductor region of a semiconductor device or a lead frame at the second end.
Claims26
A clip for a semiconductor device package, comprising:
- a metal sheet including an array of windows;
- one or more conductive fingers, each of the conductive fingers having a first end and a second end, wherein the first end is electrically connected to the metal sheet at one of the windows;
- wherein each of the conductive fingers is adapted to provide electrical connection to a top semiconductor region of a semiconductor device or a lead frame at the second end.
A semiconductor device package comprising:
- a lead frame comprising a main part and one or more leads;
- a semiconductor device comprising at least a first contact region on a top surface;
- and
- a clip comprising:
- a metal sheet including an array of windows;
- a plurality of conductive fingers, each of the conductive fingers including a first end and a second end, wherein the first end is electrically connected to the metal sheet at one of the windows;
- wherein the clip is electrically connected to the first contact region of the semiconductor device at the second ends of a first subset of the plurality of conductive fingers;
- wherein the clip electrically connects the first contact region to the lead frame;
- and
- wherein the bottom surface of the semiconductor device is located facing the main part of the lead frame.
A method of forming a semiconductor device package comprising:
- (a) attaching a semiconductor device having a first contact region on a top side thereof and to a lead frame such that a bottom side of the semiconductor device rests on a main part of the lead frame;
- (b) attaching a clip to the semiconductor device and the lead frame, wherein the clip comprises:
- a metal sheet including array of windows;
- a plurality of conductive fingers, each of the conductive fingers including a first end and a second end, wherein the first end is electrically connected to the metal sheet at one of the windows;
- wherein the clip is electrically connected to the first contact region of the semiconductor device at the second ends of the conductive fingers;
- and
- (c) encapsulating the semiconductor device and portions of the lead frame, and clip with a molding compound such that the top surface of the clip is exposed through the molding compound.
Dependencies are inferred from the claim text.