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US 2010/0072572 A1Published application
Semiconductor device
AssigneeInfineon Technologies AG
InventorsPeter BAUMGARTNER, Philipp RIESS
Life of this patent
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Abstract
One or more embodiments relate to a semiconductor device, comprising: a inductor coil including a winding; and a capacitor arrangement including at least one capacitor, the capacitor arrangement electrically coupled to the inductor coil, the footprint of the capacitor arrangement at least partially overlapping the footprint of the inductor coil.
Claims19
A semiconductor device, comprising:
- a inductor coil including a winding;
- and
- a capacitor arrangement including at least one capacitor, said capacitor arrangement electrically coupled to said inductor coil, the footprint of the capacitor arrangement at least partially overlapping the footprint of said inductor coil.
A semiconductor device, comprising:
- an inductor coil including a winding;
- and
- a capacitor arrangement including at least one capacitor, said capacitor arrangement electrically coupled to said inductor coil, said capacitor arrangement at least partially overlying or at least partially underlying said inductor coil.
A semiconductor device, comprising:
- an inductor coil including a winding;
- and
- a capacitor arrangement electrically coupled to said inductor coil, wherein the maximum magnetic field at the capacitor arrangement is at least 70% of the maximum magnetic field at the outer perimeter of said winding.
A semiconductor device, comprising:
- a substrate;
- an inductor coil disposed over said substrate;
- and
- a capacitor arrangement including at least one capacitor, said capacitor arrangement electrically coupled to said inductor coil, said capacitor arrangement disposed over said substrate, wherein at least a portion of the parasitic capacitance between said inductor coil and said substrate is shared with at least a portion of the parasitic capacitance between said capacitor arrangement and said substrate.
1 more element
Dependencies are inferred from the claim text.