Group III nitride semiconductor light-emitting device and method for producing the same
AssigneeToyoda Gosei Co., Ltd.
InventorsMasao Kamiya, Takashi Hatano
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AssigneeToyoda Gosei Co., Ltd.
InventorsMasao Kamiya, Takashi Hatano
Estimating the term…
A method for producing a Group III nitride semiconductor light-emitting device with a face-up configuration including a p-type layer and a transparent electrode composed of ITO is provided in which a p-pad electrode on the transparent electrode and an n-electrode on an n-type layer are simultaneously formed. The p-pad electrode and the n-electrode are composed of Ni/Au. The resultant structure is heat treated at 570° C. and good contact can be established in the p-pad electrode and the n-electrode. The heat treatment also provides a region in the transparent electrode immediately below the p-pad electrode, the region and the p-type layer having a higher contact resistance than that of the other region of the transparent electrode and the p-type layer. Thus, a region of an active layer below the provided region does not emit light and hence the light-emitting efficiency of the light-emitting device can be increased.
A method for producing a Group III nitride semiconductor light-emitting device with a face-up configuration, the light-emitting device including a p-type layer, a transparent electrode comprising an oxide and formed on the p-type layer, a p-pad electrode comprising Ni/Au and formed on the transparent electrode and on a surface side of the light-emitting device, and an n-electrode comprising Ni/Au and formed on the surface side of the light-emitting device;
A Group III nitride semiconductor light-emitting device having a face-up configuration, the light-emitting device including:
Dependencies are inferred from the claim text.