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US 2010/0072433 A1Published application
Resin package and production method thereof
AssigneeSumitomo Chemical Company, Limited
InventorsMitsuo MAEDA, Yasuo MATSUMI
Life of this patent
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Abstract
The method for producing a resin package according to the present invention includes a step of forming a copper oxide layer by oxidizing the surface of a lead frame in which at least the surface is made of copper, and a step of forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame surface by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution.
Claims9
A method for producing a resin package, comprising the steps of:
- (A) forming a copper oxide layer by oxidizing a surface of a lead frame in which at least the surface is made of copper, and
- (B) forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution.
A resin package, comprising:
- lead terminals,
- a copper oxide layer formed on the surface of the lead terminals,
- a plurality of side walls made of resin and provided on the copper oxide layer, and
- a metallic layer provided on the lead terminals in an area surrounded by the side walls, with no copper oxide layer interposed therebetween.
1 more element
Dependencies are inferred from the claim text.