Solder ball printing apparatus

A solder ball printing apparatus comprising a solder ball feeding head which feeds solder balls, for printing, from an opening portion formed on a mask surface onto a substrate on which a flux is printed on an electrode pad, wherein

• the solder ball feeding head includes:
• a solder ball reservoir portion which reserves the solder balls;
• an object like a sieve which feeds a predetermined amount of solder balls from the solder ball reservoir portion onto the mask surface;
• a solder ball loading member which is formed of a plurality of semi-spiral-shaped wire rods to feed the solder balls fed from the object like a sieve of the solder ball reservoir portion to the opening portion of the mask surface;
• and
• solder ball sweeping members which load the solder balls on the front and rear sides of the solder ball loading member and which are formed of the plurality of semi-spiral-shaped wire rods, on the side where they are brought into contact with the mask surface, to sweep extra solder balls.