Cold plate apparatus with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component

A fluid-cooled electronics apparatus, comprising:

• a heat generating electronics component;
• a cold plate apparatus with a surface thereof coupled to a surface of the heat generating electronics component for facilitating removing heat from the heat generating electronics component, the cold plate apparatus comprising:
• a tube comprising a first metal, the tube having a first end and a second end with a heat transfer region disposed therebetween;
• a casted heat sink member comprising a second metal surrounding the heat transfer region of a tube, with the first end and the second end of the tube extending from the casted heat sink member, wherein a metallurgical bond exists between the tube and the heat sink member in the heat transfer region of the tube;
• and
• an alloy layer between the tube and the casted heat sink member in the heat transfer region of the tube, the alloy layer having been formed during casting of the heat sink member by the first metal of the tube and the second metal of the heat sink member reacting peritectically, wherein the thickness of the alloy layer was minimized during casting of the heat sink member to enhance a heat transfer characteristic of the metallurgical bond between the tube and the heat sink member in the heat transfer region of the tube.