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US 2010/0071854 A1Published application
Apparatus and method of manufacturing a semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsGoon Woo KIM, Whasu Sin, Jae Yong Park, Hwang-Bok Ryu
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Abstract
An apparatus and a method of manufacturing a semiconductor package are provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside one equipment. Thus, time required for a semiconductor packaging process decreases and yield is increased.
Claims15
An apparatus to manufacture a semiconductor package, comprising:
- a first process unit to perform a semiconductor package manufacturing process on a first surface of a substrate;
- a reversing unit to reverse an orientation of the substrate such that a second surface of the substrate faces in a first direction;
- and
- a second process unit to perform a semiconductor package manufacturing process on the second surface of the substrate that faces in the first direction,
- wherein the first process unit, the reversing unit, and the second process unit are disposed inside an equipment housing.
2 more elements
An apparatus to manufacture a semiconductor package, comprising:
- a die attaching part to attach a semiconductor chip to a substrate;
- a buffer part disposed adjacent to the die attaching part that includes a space to hold the substrate transferred from the die attaching part;
- and
- a wire bonding part disposed adjacent to the buffer part to electrically connect the semiconductor chips attached to the substrate transferred from the buffer part to terminals of the substrate,
- wherein the die attaching part includes first and second die attaching units to attach the semiconductor chip to a surface of the substrate that faces in a first direction,
- wherein the wire bonding part includes first and second wire bonding units to electrically connect the semiconductor chips attached to the surface of the substrate that faces in the first direction to terminals of the substrate, and
- wherein reversing units to reverse an orientation of the substrate are disposed between the first and second die attaching units and between the first and second wire bonding units, respectively.
4 more elements
15-22. (canceled)
Dependencies are inferred from the claim text.