Method of producing multilayer structure
AssigneeFUJIFILM Corporation
InventorHiroshi SATO
Life of this patent
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Abstract
A method of producing a multilayer structure including a substrate, an adhesive layer and a metal layer, the method including: forming the adhesive layer on the substrate or a metal foil that forms the metal layer by applying a composition containing an acrylic resin having a repeating unit that is derived from an ethylenic unsaturated monomer having a divalent sulfur atom, and applying energy to the composition; and (if the adhesive layer is formed on the substrate) forming the metal layer on the adhesive layer by laminating a metal foil or forming a metal film by evaporation or sputtering, or (if the adhesive layer is formed on the metal foil) forming an organic resin layer that forms the substrate on the adhesive layer by a casting method.
Claims18
A method of producing a multilayer structure including a substrate, an adhesive layer and a metal layer, the method comprising:
- (a1) forming the adhesive layer on the substrate by applying a composition to the substrate, the composition comprising an acrylic resin having a repeating unit that is derived from an ethylenic unsaturated monomer having a divalent sulfur atom, and applying energy to the composition;
- and
- (b1) forming the metal layer on the adhesive layer by laminating a metal foil or by forming a metal film by evaporation or sputtering.
A method of producing a multilayer structure including a substrate, an adhesive layer and a metal layer, the method comprising:
- (a2) forming the adhesive layer on a metal foil that forms the metal layer by applying a composition to the metal foil, the composition comprising an acrylic resin having a repeating unit that is derived from an ethylenic unsaturated monomer having a divalent sulfur atom, and applying energy to the composition;
- and
- (b2) forming the substrate on the adhesive layer by forming a film of an organic resin by a casting method.
Dependencies are inferred from the claim text.