Low cost die release wafer
AssigneeEastman Kodak Company
InventorsRoger S. Kerr, Timothy J. Tredwell, Seung-Ho Baek
Life of this patent
Estimating the term…
Abstract
Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be glass with the IC elements grown on the glass. In some embodiments, the release member can be used for a low cost placement of the IC elements in combination with an intermediate transfer layer.
Claims20
A method for assembling integrated circuits comprising:
- forming a integrated circuit (IC) layer on a phase change material of a release member;
- forming a plurality of bump bonds on the IC layer of the release member;.
- forming one or more spaced dies on the phase change material by etching through the IC layer, wherein each spaced die comprises one or more bump bonds formed on an etched IC layer;
- and
- exposing the phase change material to an energy to induce a phase change for selectively releasing the one or more spaced dies from the release member.
A method for assembling integrated circuits comprising:
- forming a silicon layer on a phase change material of a release member;
- forming a plurality of bump bonds on the silicon layer of the release member;
- forming one or more spaced dies on the phase change material by etching through the silicon layer, wherein each spaced die comprises one or more bump bonds formed on an etched silicon layer;
- coupling an intermediate transfer member onto a first surface of the one or more spaced dies;
- exposing the phase change material to an energy to induce a phase change for selectively releasing the one or more spaced dies from the release member;
- removing the release member and exposing a second surface of the one or more spaced dies, wherein the second surface is substantially parallel to the first surface;
- coupling a second phase change surface of a second release member onto the exposed second surface of the one or more spaced dies;
- removing the intermediate transfer member from the first surface of the one or more spaced dies;
- and
- exposing the coupled phase change material to an energy for selectively releasing the one or more dies from the release member.
A method for controlling an assembly of IC elements comprising:
- coupling one or more IC elements onto a phase change material of a release member;
- selectively inspecting a group of the one or more IC elements on the phase change material;
- and
- selectively applying an energy to a portion of the phase change material to release an inspected IC element for repair.
An assembly of IC elements comprising:
- a release member comprising a glass support and a phase change material formed on the glass support;
- and
- one or more spaced IC elements coupled to the phase change material of the release member.
Dependencies are inferred from the claim text.