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US 2010/0071205 A1Published application
Method and apparatus for attaching chip to a textile
AssigneeIntel Corporation
InventorsDavid Graumann, David Bruneau
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.
Claims18
A method, comprising:
- making a textile on a loom, said textile having a chip line;
- securing a target site that includes the chip line;
- mounting a chip package to the chip line;
- and
- attaching the chip line to the chip package at two or more locations so that when it is severed between the two or more locations, the chip line retains sufficient tension within the textile.
2 more elements
An apparatus, comprising:
- a portion of a chip package to be mounted to a textile, said portion having a connector with a first set of pads having gaps between the pads and a second set of pads to overlap the gaps of the first set of pads.
An apparatus, comprising:
- an electronic module package to mount to a textile, the package having first and second portions, the first portion having redundant pads for connection to wires in the textile.
Dependencies are inferred from the claim text.