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US 2010/0064114 A1Published application
Stacked device identification assignment
AssigneeMicron Technology, Inc.
InventorBrent Keeth
Life of this patent
Estimating the term…
Abstract
Some embodiments include apparatus and methods having dice arranged in a stack. The dice include at least a first die and a second die, and a connection coupled to the dice. The connection may be configured to transfer control information to the first die during an assignment of a first identification to the first die and to transfer the control information from the first die to the second die during an assignment of a second identification to the second die.
Claims40
An apparatus comprising:
- dice arranged in a stack, the dice including at least a first die and a second die;
- and
- a connection coupled to the dice and configured to transfer control information to the first die during an assignment of a first identification to the first die and to transfer the control information from the first die to the second die during an assignment of a second identification to the second die.
An apparatus comprising:
- dice arranged in a stack, each of the dice including a logic component configured to form a portion of a connection extending through at least one of the dice to sequentially transfer control information to the dice;
- and
- a module configured to assign identifications to the dice when the control information is transferred on the connection.
An apparatus comprising:
- a first die including a first logic component having a first input node configured to receive control information, a second input node configured to receive first enable information, and a first output node;
- a second die including a second logic component having a third input node coupled to the first output node, a fourth input node configured to receive second enable information, and a second output node;
- and
- a third die including a third logic component having a fifth input node coupled to the second output node, a sixth input node configured to receive third enable information, and a third output node, wherein the first die, the second die, and the third die are arranged in a stack.
1 more element
An apparatus comprising:
- a first die including a first contact, a second contact, and a logic AND gate having an input node coupled to the first contact and a first output node coupled to the second contact;
- and
- a second die arranged in a stack with the first die, the second die including a first contact, a second contact, and a logic AND gate having an input node coupled to the first contact and a second output node coupled to the second contact;
- and
- a conductive joint outside the first die and outside the second die, the conductive joint being coupled to the second contact of the first die and the first contact of the second die.
2 more elements
A method comprising:
- transferring control information to dice arranged in a stack, wherein the control information is transferred to a first die of the dice before the control information is transferred from the first die to a second die of the dice;
- assigning a first identification to the first die when the control information is transferred to the first die;
- and
- assigning a second identification to the second die when the control information is transferred to the second die.
1 more element
A method comprising:
- positioning a first die;
- and
- arranging a second die in a stack with the first die, each of the first die and the second die including a portion of a connection used to transfer control information to the stack during an assignment of a first identification to the first die and an assignment of a second identification to the second die.
Dependencies are inferred from the claim text.