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US 2010/0063572 A1Published application
Composite detachment mechanisms
AssigneeBoston Scientific Scimed, Inc.
InventorsClifford Teoh, Francis Tang
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Abstract
Described herein are composite detachment mechanisms for implantable devices and assemblies comprising these devices. Also provided are methods of using the detachment mechanisms and assemblies.
Claims25
An assembly comprising:
- an implantable device, and
- a composite detachment mechanism comprising a polymer and one or more conductive materials, wherein the composite detachment mechanism is engaged with the implantable device until sufficient thermal energy is applied to the detachment mechanism to allow disengagement of the implantable device from the composite detachment mechanism.
Dependencies are inferred from the claim text.