Curable Silicone Composition and Electronic Component

A curable silicone composition comprising at least the following components:

• (A) (A1) an organopolysiloxane that contains in one molecule at least two epoxy-containing univalent organic groups and is represented by the following average unit formula:
• (R13SiO1/2)a(R22SiO2/2)b(R3SiO3/2)c
• where, R1, R2, and R3 may be the same or different and designate substituted or unsubstituted monovalent hydrocarbon groups or epoxy-containing monovalent hydrocarbon groups;
• however, at least 20 mole % of the groups designated by R3 are aryl groups;
• and where “a”, “b”, and “c” are numbers that satisfy the following conditions:
• 0≦a≦0.8;
• 0≦b≦0.8;
• 0.2≦c≦0.9;
• a+b+c=1, and/or (A2) a diorganopolysiloxane of the following general formula:
• A-R5—(R42SiO)mR42Si—R5-A
• where R4 is a substituted or unsubstituted monovalent hydrocarbon group which is free of unsaturated aliphatic bonds;
• R5 is bivalent organic group;
• and “A” is a siloxane residual radical represented by the following average unit formula:
• (XR42SiO1/2)d(SiO4/2)e
• where R4 is the same as defined above, and “X” is a single bond, a hydrogen atom, a group designated by R4, an epoxy-containing monovalent organic group, or an alkoxysilylalkyl group;
• however, at least one group designated by “X” in one molecule is a single bond, at least two groups designated by “X” are epoxy-containing monovalent organic groups;
• “d” is a positive number;
• “e” is a positive number;
• and “die” is a number ranging from 0.2 to 4, and where “m” is an integer equal to or greater than 1;
• (B) a curing agent for epoxy resin;
• and
• (C) an epoxy compound represented by the following general formula:
• where R8 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms;
• and “f” is an integer from 0 to 4.