Methods for retaining metal-comprising materials using liquid chemistry dispense systems from which oxygen has been removed
AssigneeAdvanced Micro Devices, Inc.
InventorBalgovind SHARMA
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Abstract
Methods for fabricating a semiconductor device from a semiconductor substrate having a metal-comprising material and a disposable material are provided. In accordance with an exemplary embodiment, the method comprises providing a system for exposing the disposable material to a liquid chemistry and removing oxygen from the system. The disposable material is exposed to the liquid chemistry and is removed from the semiconductor substrate using the liquid chemistry and simultaneously the metal-comprising material is left substantially in tact.
Claims20
A method for fabricating a semiconductor device from a semiconductor substrate having a metal-comprising material and a disposable material, the method comprising the steps of:
- providing a system for exposing the disposable material to a liquid chemistry;
- removing oxygen from the system;
- exposing the disposable material to the liquid chemistry;
- and
- removing the disposable material from the semiconductor substrate using the liquid chemistry and simultaneously leaving the metal-comprising material substantially in tact.
A method for removing a disposable material from a semiconductor substrate, wherein the semiconductor substrate has a metal-comprising material, the method comprising:
- removing oxygen from a surface of the semiconductor substrate;
- applying a liquid chemistry to the disposable material and the metal-comprising material;
- and
- removing the disposable material from the semiconductor substrate using the liquid chemistry without substantial removal of the metal-comprising material.
A method for removing a disposable material from a semiconductor substrate, wherein the semiconductor substrate has a metal-comprising material, the method comprising:
- removing oxygen from a liquid chemistry such that the liquid chemistry has no more than 30 ppb of dissolved oxygen;
- exposing the disposable material to the liquid chemistry;
- and
- removing the disposable material from the semiconductor substrate without substantial removal of the metal-comprising material.
Dependencies are inferred from the claim text.