Microelectronic devices and methods for manufacturing microelectronic devices
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Zhong-Yi Xia, Sandhya Sandireddy
Life of this patent
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Abstract
Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a device includes a support member and a flexed microelectronic die mounted to the support member. The flexed microelectronic die has a plurality of terminals electrically coupled to the support member and an integrated circuit operably coupled to the terminals. The die can be a processor, memory, imager, or other suitable die. The support member can be a lead frame, a plurality of electrically conductive leads, and/or an interposer substrate.
Claims32
A method for manufacturing a microelectronic device, the method comprising:
- attaching a microelectronic die to a support member;
- bending the microelectronic die;
- and
- encapsulating at least a portion of the support member and the bent microelectronic die.
A method for manufacturing a microelectronic device, the method comprising:
- mounting a processor or memory die to a support member, the processor or memory die having an integrated circuit and a plurality of terminals operably coupled to the integrated circuit;
- electrically coupling the terminals of the processor or memory die to the support member;
- flexing the processor or memory die such that the die has a curved surface;
- and
- encapsulating at least a portion of the flexed processor or memory die and the support member with a casing.
A method for manufacturing a microelectronic device, the method comprising:
- coupling a microelectronic die to a support member with a plurality of terminals on the die electrically coupled to the support member;
- and
- bending the microelectronic die such that a refresh time of the die is increased.
Dependencies are inferred from the claim text.