Positive resist composition and patterning process
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsTsunehiro NISHI, Takeshi KINSHO, Masaki OHASHI, Koji HASEGAWA, Masashi IIO
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Abstract
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising recurring units containing a non-leaving hydroxyl group represented by at least one of formulae (1-1) to (1-3) wherein R1 is H, methyl or trifluoromethyl, X is a single bond or methylene, Y is hydroxyl or hydroxymethyl, and m is 0, 1 or 2. The composition is improved in resolution when processed by lithography.
Claims6
A positive resist composition comprising (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) a compound capable of generating an acid in response to actinic light or radiation, wherein
- said resin component (A) is a polymer comprising non-leaving hydroxyl group-containing recurring units of at least one type selected from the general formulae (1-1) to (1-3):
- wherein R1 is hydrogen, methyl or trifluoromethyl, X is a single bond or methylene, Y is hydroxyl or hydroxymethyl, and m is 0, 1 or 2.
Dependencies are inferred from the claim text.